Lehrbeauftragter
Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz
In: IEEE Transactions on Components, Packaging and Manufacturing Technology vol. 11 pg. 1-11.
DOI: 10.1109/TCPMT.2021.3118720
Reliability Investigations of Additive Manufactured RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology
Comparison of an Inkjet Fabrication Method on Low-Cost PCB Substrates With Semi Additive And Subtractive Technologies Regarding RF-Performance
pg. 266-268.
DOI: 10.1109/IMWS-AMP53428.2021.9643887
A Cost-Effective Method for Extracting the Complex Permittivity of Inner Layer Dielectric PCB Materials
Comparison of an Inkjet Fabrication Method on Low Cost PCB Substrates With Semi Additive And Subtractive Technologies Regarding RF-Performance
Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz . [Invited Talk]
DOI: 10.1109/IMWS-AMP49156.2020.9199738
Ein flexibles Leiterplatten-Technologiekonzept für Anwendungen im Millimeterwellenbereich . Dissertationsschrift
In: Elektrotechnik
Verlag Dr. Hut München
Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards . Invited Talk
In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Institute of Electrical and Electronics Engineers Inc. San José, CA, USA
Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz . Invited Talk
In: 2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
Institute of Electrical and Electronics Engineers Inc. Suzhou, China
Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air
In: IEEE Transactions on Microwave Theory and Techniques vol. 68 pg. 2134-2143.
DOI: 10.1109/TMTT.2020.2983934
Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards . [Invited Talk]
Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz . Invited Talk
In: 2020 German Microwave Conference (GeMiC)
Cottbus
Multi-Layer Topology Optimization of Wideband SIW-to-Waveguide Transitions
In: IEEE Transactions on Microwave Theory and Techniques vol. 68 pg. 1326-1339.
DOI: 10.1109/TMTT.2019.2959759
Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards . [Invited Talk]
DOI: 10.1109/EPEPS48591.2020.9231382
Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz . [Invited Talk]
Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards
In: 2020 50th European Microwave Conference (EuMC)
Institute of Electrical and Electronics Engineers Inc. Utrecht, The Netherlands
Bare die connections via aerosol jet technology for millimeter wave applications
In: International Journal of Microwave and Wireless Technologies vol. 11 pg. 441-446.
DOI: 10.1017/S1759078719000114
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) . Abschlussbericht
Technische Hochschule Deggendorf (THD)/Technologie Campus Teisnach
WR12 to planar transmission line transition on organic substrate
DOI: 10.23919/EuMC.2019.8910843
Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air . Invited Talk
In: IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP)
Bochum
Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air
DOI: 10.1109/IMWS-AMP.2019.8880079
WR12 to planar transmission line transition on organic substrate . Invited Talk
In: 49th European Microwave Conference (EuMC)
Paris, Frankreich
Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) . Projektbericht
Technische Hochschule Deggendorf/Technologie Campus Teisnach
Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications
DOI: 10.23919/EuMC.2017.8230878
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages . An effort to design an all-purpose RF chip package
pg. 536-539.
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages . An effort to design an all-purpose RF chip package
pg. 1465-1468.
Thermisches Management für Leiterplatten-basierte Hochfrequenz-Packages
In: PLUS - Fachzeitschrift für Aufbau und Verbindungstechnik in der Elektronik: Produktion von Leiterplatten und Systemen
Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions . An effort to design an all-purpose RF chip package
pg. 781-784.