Lehrbeauftragter
An Effective Surface Impedance Concept to Model Arbitrary Roughness Profiles on Printed Circuit Boards up to 110 GHz . [Accepted for publication]
Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz
In: IEEE Transactions on Components, Packaging and Manufacturing Technology vol. 11 pg. 1-11.
DOI: 10.1109/TCPMT.2021.3118720
Reliability Investigations of Additive Manufactured RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology
DOI: 10.23919/EuMC50147.2022.9784224
Comparison of an Inkjet Fabrication Method on Low-Cost PCB Substrates With Semi Additive And Subtractive Technologies Regarding RF-Performance
pg. 266-268.
DOI: 10.1109/IMWS-AMP53428.2021.9643887
A Cost-Effective Method for Extracting the Complex Permittivity of Inner Layer Dielectric PCB Materials
DOI: 10.23919/EuMC50147.2022.9784297
Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards . [Invited Talk]
Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards . [Invited Talk]
DOI: 10.1109/EPEPS48591.2020.9231382
Ein flexibles Leiterplatten-Technologiekonzept für Anwendungen im Millimeterwellenbereich . Dissertationsschrift
In: Elektrotechnik
Verlag Dr. Hut München
Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz . [Invited Talk]
Multi-Layer Topology Optimization of Wideband SIW-to-Waveguide Transitions
In: IEEE Transactions on Microwave Theory and Techniques vol. 68 pg. 1326-1339.
DOI: 10.1109/TMTT.2019.2959759
Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz . Invited Talk
In: 2020 German Microwave Conference (GeMiC)
Cottbus
Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz . [Invited Talk]
DOI: 10.1109/IMWS-AMP49156.2020.9199738
Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards . Invited Talk
In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Institute of Electrical and Electronics Engineers Inc. San José, CA, USA
Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz . Invited Talk
In: 2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
Institute of Electrical and Electronics Engineers Inc. Suzhou, China
Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air
In: IEEE Transactions on Microwave Theory and Techniques vol. 68 pg. 2134-2143.
DOI: 10.1109/TMTT.2020.2983934
Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards
In: 2020 50th European Microwave Conference (EuMC)
Institute of Electrical and Electronics Engineers Inc. Utrecht, The Netherlands
Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air . Invited Talk
In: IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP)
Bochum
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) . Abschlussbericht
Technische Hochschule Deggendorf (THD)/Technologie Campus Teisnach
Bare die connections via aerosol jet technology for millimeter wave applications
In: International Journal of Microwave and Wireless Technologies vol. 11 pg. 441-446.
DOI: 10.1017/S1759078719000114
Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air
DOI: 10.1109/IMWS-AMP.2019.8880079
WR12 to planar transmission line transition on organic substrate
DOI: 10.23919/EuMC.2019.8910843
WR12 to planar transmission line transition on organic substrate . Invited Talk
In: 49th European Microwave Conference (EuMC)
Paris, Frankreich
Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) . Projektbericht
Technische Hochschule Deggendorf/Technologie Campus Teisnach
Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications
DOI: 10.23919/EuMC.2017.8230878
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages . An effort to design an all-purpose RF chip package
pg. 536-539.
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages . An effort to design an all-purpose RF chip package
pg. 1465-1468.
Thermisches Management für Leiterplatten-basierte Hochfrequenz-Packages
In: PLUS - Fachzeitschrift für Aufbau und Verbindungstechnik in der Elektronik: Produktion von Leiterplatten und Systemen
Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions . An effort to design an all-purpose RF chip package
pg. 781-784.