Contribution
  • Johannes Jakob
  • R. Sammer
  • Franz Xaver Röhrl
  • Stefan Zorn
  • Werner Bogner
WR12 to planar transmission line transition on organic substrate
  • 2019

DOI: 10.23919/EuMC.2019.8910843

Transitions for planar transmission lines on printed circuit boards to rectangular waveguide are challenging to design and manufacture. This paper introduces two transitions, the first one is a broadband transition from WR12 (60-90 GHz) waveguide to a stripline (SL) and the second is a narrowband transition to a grounded coplanar waveguide (GCPW). The focus at the first transition is based on the fact that signals can be transmitted in the complete E-Band. In the process, many manufacturing possibilities were exploited. For the second transition, the focus was on manufacturability in order to achieve the most cost effective transition possible. Design, simulated and measured results will be presented.
JournalArticle
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • Stefan Zorn
Bare die connections via aerosol jet technology for millimeter wave applications , vol11
  • 2019

DOI: 10.1017/S1759078719000114

This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.
UnpublishedWork
  • Franz Xaver Röhrl
  • Siegfried Hildebrand
  • Johannes Jakob
  • Stefan Zorn
  • Werner Bogner
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) Abschlussbericht
  • 2019
Contribution
  • Johannes Jakob
  • R. Sammer
  • Franz Xaver Röhrl
  • Stefan Zorn
  • Werner Bogner
WR12 to planar transmission line transition on organic substrate
  • 2019

DOI: 10.23919/EuMC.2019.8910843

Transitions for planar transmission lines on printed circuit boards to rectangular waveguide are challenging to design and manufacture. This paper introduces two transitions, the first one is a broadband transition from WR12 (60-90 GHz) waveguide to a stripline (SL) and the second is a narrowband transition to a grounded coplanar waveguide (GCPW). The focus at the first transition is based on the fact that signals can be transmitted in the complete E-Band. In the process, many manufacturing possibilities were exploited. For the second transition, the focus was on manufacturability in order to achieve the most cost effective transition possible. Design, simulated and measured results will be presented.
JournalArticle
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • Stefan Zorn
Bare die connections via aerosol jet technology for millimeter wave applications , vol11
  • 2019

DOI: 10.1017/S1759078719000114

This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.
UnpublishedWork
  • Franz Xaver Röhrl
  • Siegfried Hildebrand
  • Johannes Jakob
  • Stefan Zorn
  • Werner Bogner
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) Abschlussbericht
  • 2019
Lecture
  • Johannes Jakob
  • R. Sammer
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn
WR12 to planar transmission line transition on organic substrate Invited Talk
  • 2019
Lecture
  • Johannes Jakob
  • R. Sammer
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn
WR12 to planar transmission line transition on organic substrate Invited Talk
  • 2019
Lecture
  • Johannes Jakob
Rechnergestützte Optimierung von galvanischen Kupferabscheideprozessen Posterpräsentation
  • 2018
Contribution
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • Stefan Zorn
Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications
  • 2018
Lecture
  • Johannes Jakob
Rechnergestützte Optimierung von galvanischen Kupferabscheideprozessen Posterpräsentation
  • 2018
Contribution
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • Stefan Zorn
Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications
  • 2018
Contribution
  • Franz Xaver Röhrl
  • Roman Sammer
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • U. Hassel
  • Stefan Zorn
Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications
  • 2017

DOI: 10.23919/EuMC.2017.8230878

Contribution
  • Franz Xaver Röhrl
  • Roman Sammer
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • U. Hassel
  • Stefan Zorn
Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications
  • 2017

DOI: 10.23919/EuMC.2017.8230878

UnpublishedWork
  • Franz Xaver Röhrl
  • Siegfried Hildebrand
  • Johannes Jakob
  • Stefan Zorn
  • Werner Bogner
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) Projektbericht
  • 2017
UnpublishedWork
  • Franz Xaver Röhrl
  • Siegfried Hildebrand
  • Johannes Jakob
  • Stefan Zorn
  • Werner Bogner
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) Projektbericht
  • 2017
Contribution
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
  • Stefan Zorn
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages An effort to design an all-purpose RF chip package
  • 2016
Contribution
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
  • Stefan Zorn
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages An effort to design an all-purpose RF chip package
  • 2016
Contribution
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
  • Stefan Zorn
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages An effort to design an all-purpose RF chip package
  • 2016
Contribution
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
  • Stefan Zorn
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages An effort to design an all-purpose RF chip package
  • 2016
Contribution
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions An effort to design an all-purpose RF chip package
  • 2015
Contribution
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions An effort to design an all-purpose RF chip package
  • 2015
Contribution
  • A. Bauer
  • Johannes Jakob
  • R. Gmiha
  • D. Hageneder
  • Werner Bogner
Embedded Resistors for High Frequency Applications on Printed Circuit Boards
  • 2013
Contribution
  • A. Bauer
  • Johannes Jakob
  • R. Gmiha
  • D. Hageneder
  • Werner Bogner
Embedded Resistors for High Frequency Applications on Printed Circuit Boards
  • 2013